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8300A | Invensys Triconex | Tricon Power Module HPM I/O Link Interface Card Additional components: Inductor beads (25+)

SKU: 36025422239
4.6
USD180.00 USD223.00

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USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 8 - Aug 13

Description

Additional components: Inductor beads (25+)

Panel mounting: Required for high vibration environments

IC693DNM200 is a DeviceNet Master Module from GE Fanuc for Series 90-30 and PACSystems RX3i

Realtime-SMP / Core Reservation: No

8300A | Invensys Triconex | Tricon Power Module HPM I/O Link Interface Card Additional components: Inductor beads (25+)Description The Triconex 8300A Power Module supplies regulated power to Tricon Low Density Main Chassis systems. Electrical Supply Power Type: TRICON Power Module Compatible Chassis: Tricon Low Density Main Chassis Input Voltage: 115120 VAC Physical Specifications Dimensions: 63 178 394 mm Weight: 3. 3 kg

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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